Scott Smith retired earlier his year from GE Research. He earned B.S. and Ph.D. degrees in physics from the University of Rochester and the University of Pennsylvania respectively. Joining GE in 1976, he developed phased array probes for medical ultrasound. More recently, he led projects on adaptive acoustics and novel probe materials and fabrication methods. Dr. Smith has over 55 issued patents and over 40 refereed publications. He is a fellow of the American Physical Society and an IEEE Life Fellow. He was also General Co-Chair of last year’s International Ultrasonics Symposium.
David M. Mills is a senior scientist with GE Global Research. He earned a B.S. degree in engineering from LeTourneau University, Longview, TX and a Ph.D. degree in biomedical engineering from Duke University, Durham, NC. In 2000, he joined GE as an ultrasound probes engineer, designing medical ultrasound transducers using PZFlex (now OnScale) simulations for both piezoelectric and cMUT based transducers. Another research interest is in new clinical applications for ultrasound that are enabled by real-time 3D ultrasound imaging, visualization algorithms, and customized user interfaces. Dr. Mills has over 25 issued patents and has authored more than 10 external publications. He is a member of the IEEE.
Jafar Saniie (IEEE Life Fellow for contributions to ultrasonic signal processing for detection, estimation, and imaging) received his B.S. degree with high honors in Electrical Engineering from the University of Maryland in 1974. He received his M.S. degree in Biomedical Engineering in 1977 from Case Western Reserve University, Cleveland, Ohio, and his Ph.D. degree in Electrical Engineering in 1981 from Purdue University, West Lafayette, Indiana. In 1981 Dr. Saniie joined the Department of Applied Physics, University of Helsinki, Finland, to research photothermal and photoacoustic imaging. Since 1983 he has been with the Department of Electrical and Computer Engineering at Illinois Institute of Technology where he is the Department Chair, the Filmer Endowed Chair Professor, and Director of Embedded Computing and Signal Processing (ECASP) Research Laboratory ( http://ecasp.ece.iit.edu/ ). Dr. Saniie’s research interests and activities are in ultrasonic signal and image processing, ultrasonic software-defined communication, artificial intelligence and machine learning, statistical pattern recognition, estimation and detection, data compression, time-frequency analysis, embedded digital systems, system-on-chip hardware/software co-design, Internet of things, computer vision, and deep learning, and ultrasonic nondestructive testing and imaging. Dr. Saniie has been a Technical Program Committee member of the IEEE Ultrasonics Symposium since 1987 (The Chair of Sensors, NDE and Industrial Applications Group, 2004-2013), Associate Editor of the IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control since 1994, the Lead Guest Editor for the IEEE Ultrasonics, Ferroelectrics and Frequency Control (UFFC) Special Issue on Ultrasonics and Ferroelectrics (August 2014), the IEEE UFFC Special Issue on Novel Embedded Systems for Ultrasonic Imaging and Signal Processing (July 2012), and Special Issue on Advances in Acoustic Sensing, Imaging, and Signal Processing published in the Journal of Advances in Acoustics and Vibration, 2013. Dr. Saniie was the General Chair for the 2014 IEEE Ultrasonics Symposium in Chicago. He has served as the IEEE UFFC Ultrasonics Awards Chair since 2018. He served as the Ultrasonics Vice President of the IEEE UFFC Society (2014-2017). He has over 370 publications and has supervised 37 Ph.D. dissertations, and 22 MS Theses to completion. Dr. Saniie received the 2007 University (Illinois Institute of Technology) Excellence in Teaching Award.
Erdal Oruklu (IEEE Senior Member) received his B.S. degree in Electronics and Communications Engineering from Technical University of Istanbul, Turkey in 1995, his M.S. degree in Electrical Engineering from Bogazici University, Istanbul, Turkey in 1999, and his Ph. D. degree in Computer Engineering from Illinois Institute of Technology, Chicago, Illinois in 2005. He joined the Department of Electrical and Computer Engineering, Illinois Institute of Technology in 2005, where he is an Associate Professor and the Director of VLSI and SoC Design Research Laboratory. Dr. Oruklu’s research interests are reconfigurable computing, advanced computer architectures,
hardware/software co-design, embedded systems, and high-speed computer arithmetic. In particular, he focuses on the research and development of system-on-chip (SoC) frameworks for FPGA and VLSI implementations of real-time ultrasonic detection, estimation, and imaging applications. Dr. Oruklu has more than 130 technical publications. He is a senior member of IEEE.
Graeme F. Woodworth, M.D. is Professor and Chair of the Department of Neurosurgery at the University of Maryland School of Medicine. He also serves as the Director of the Brain Tumor Program within the Greenebaum Comprehensive Cancer Center at the University of Maryland. His subspecialty areas of interest are Stereotactic and Skull Base neurosurgery and Neurosurgical Oncology. Dr. Woodworth’s research focuses on developing new therapeutic strategies to improve the treatments and outcomes for patients with malignant brain tumors. These efforts include (1) leveraging the diverse interstitial effects of transcranial focused ultrasound and (2) developing advanced nano-therapeutics to improve drug delivery.
Damien Garcia obtained his engineering degree in solid and fluid mechanics in Marseille, France. He obtained a master’s and doctoral degree in biomedical engineering from the University of Montreal, Canada, in 2003. He was a postdoctoral fellow in the Department of Echocardiography at the Gregorio Marañón University General Hospital in Madrid, Spain, in 2007-2008. He then became Assistant and Associate Professor in the Department of Radiology at the Université de Montréal until mid-2016. He is currently an INSERM researcher in Creatis, Lyon, France, since 2017. He is Associate Editor of the IEEE TUFFC. He is also a member of the Technical Program Committee of the IEEE Ultrasound Symposium. His research interests include Doppler echocardiography, cardiovascular hemodynamics & vector flow imaging.
He was the main organizer of the UFFC2019 US School on ultrasound motion imaging & experimentations. Courses are available here: http://www.biomecardio.com/UFFCschool2019/program.html
Sandy Cochran is Professor of Ultrasound Materials and Device in the Centre for Medical and Industrial Ultrasonics at the University of Glasgow, Scotland. He is Co-Director of the UK Centre for Doctoral Training in Future Ultrasonic Engineering. He received his B.Sc. degree in electronics in 1986, Ph.D. for work on ultrasonic arrays in 1990, and MBA in 2001, all from the University of Strathclyde. His present research interests focus on medical ultrasound materials, devices and systems with applications in diagnosis and therapy, specifically including ultrasound capsule endoscopy. He is a Fellow or Member of various learned societies and co-author of almost 300 papers and conference presentations and an inventor on 10 patents.
Prof. Shuji Tanaka received B.E., M.E. and Dr.E. degrees in mechanical engineering from The University of Tokyo in 1994, 1996 and 1999, respectively. He was a Research Associate at Department of Mechatronics and Precision Engineering, Tohoku University from 1999 to 2001, an Assistant Professor from 2001 to 2003, and an Associate Professor at Department of Nanomechanics from 2003 to 2013. He is currently a Professor at Department of Robotics and Microsystem Integration Center. He was also a Fellow of Center for Research and Development Strategy, Japan Science and Technology Agency from 2004 to 2006, and a Selected Fellow from 2006 to 2018. In FY2017, he served as the President of Micro-Nano Science & Engineering Division, Japan Society of Mechanical Engineers (JSME). At present, he is serving as the Vice-Chair (Group 4 Chair) of Technical Program Committee (TPC) of IEEE International Ultrasonics Symposium and an AdCom member of IEEE UFFC Society. He will also serve as General Chair of IEEE MEMS 2022 and TPC Chair of Transducers 2023. His research interests include MEMS sensors, acoustic wave devices, piezoelectric devices and materials, and wafer-level packaging and integration. He is an IEEE Fellow and a JSME Fellow.
Billy Y. S. Yiu received his B.Eng. degree (Hons.) in medical engineering and the M.Phil degree in electrical and electronic engineering from The University of Hong Kong in 2007 and 2010, respectively. He was awarded his Ph.D. degree in electrical and computer engineering from the University of Waterloo, Waterloo, ON, Canada, in 2019. He was a research staff member with the Biomedical Ultrasound Laboratory in The University of Hong Kong from 2010 to 2016, and currently serves as an associate scientist with the Laboratory on Innovative Technology in Medical Ultrasound (LITMUS), University of Waterloo.
Billy’s research interests are in advanced ultrasound imaging techniques and systems innovations; GPU implementation of these novel imaging techniques on research platforms for real-time performance has been of his long-standing interest dating back to 2010. Some of his contributions include high-frame-rate DAS beamforming, adaptive beamforming, eigen-based clutter filtering and speckle imaging in which he has published several journal articles based on these works.