scia Systems is a full range supplier of advanced ion beam and plasma processing equipment. The systems are applicable for etching (e.g., delayering of dies), trimming (e.g., surface correction of filter devices) and coating (e.g., temperature compensation films) processes in the production of microelectronics and MEMS.
Our process equipment achieves Angstrom precision in frequency, surface and thickness trimming, in manufacturing of BAW and SAW devices. The industry proven scia Trim 200, enables ion beam trimming of functional layers in compound wafers, which leads to excellent material properties.
Due to their flexible and modular design, the systems can be configured according to customer specific requirements for both, high volume production as well as research and development environments. Together with our worldwide service partners, we offer comprehensive service and superior technology support.

IEEE IUS Mailing List

Receive IUS updates straight to your inbox!

Special Thanks

Conference Sponsors

  • 00Days Until the Conference

Contact Us

IEEE websites place cookies on your device to give you the best user experience. By using our websites, you agree to the placement of these cookies. To learn more, read our Privacy Policy.