Ieee Mb White

Invited Speaker

Prof. David Horsley

David A. Horsley received his PhD in Mechanical Engineering from the University of California, Berkeley, in 1998. He is a Professor of Mechanical and Aerospace Engineering at the University of California, Davis, and an Adjunct Professor of Mechanical Engineering at the University of California, Berkeley, where he is co-director of the Berkeley Sensor and Actuator Center (BSAC). He is also co-founder and CTO of Chirp Microsystems Inc. (a TDK Group Company), a manufacturer of ultrasonic sensors using MEMS technology. Dr. Horsley was Co-Chair of the 2016 IEEE Sensors Conference, Co-Chair of the 2017 Transducers Research Foundation Napa Microsystems Workshop, and Co-Chair of the 2020 IEEE MEMS Conference. Dr. Horsley is a fellow of the National Academy of Inventors, is a recipient of the National Science Foundation’s CAREER Award, the UC Davis Outstanding Junior Faculty Award, the 2016 NSF I/UCRC Association’s Schwarzkopf Award for Technological Innovation, and the 2018 East Bay Innovation Award. He has authored or co-authored over 150 scientific papers and holds over 22 patents.

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